Fused Silica Micro-Powder

Fused Silica Micro-Powder

Product Description

With small linear expansion coefficient, low internal stress, outstanding temperature resistance, and low radioactivity, etc. And can be perfectly used as the filler of 3um and 1um ICs. Mainly used for epoxy sealing for large or extremely large scale integrated circuits, semiconductor devices, and microelectronic components.

Size Available: From 200 mesh to 4-5um, or produce it acc. To our client's request.

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